1 

Number of layers 

1-10 floors 

2 

Maximum processing area

400*500mm 

3 

Minimum plate thickness

4Layer 0.40mm /16mil 

6Layer1.00mm /40mil 

8 Layer 1.20mm /48mil 

10 Layer 1.50mm /60mil 

4 

Minimum line width 

0.12mm /5mil 

5 

Minimum spacing 

0.12mm /5mil 

6 

Minimum aperture 

0.3mm/12mil 

7 

Metallized aperture tolerance 

±0.076mm/3mil 

8 

Copper thickness of hole wall

0.020mm/0.8mil

9 

Hole location tolerance 

±0.05mm/2mil 

10 

External dimension tolerance 

±0.15mm/4mil 

11 

Minimum solder bridge 

0.1mm/4mil 

12 

Twist and bend 

≤0.7 

13 

Insulation resistance 

>10mΩ 

14 

Pore resistance 

＜300Ω Normal behavior 

15 

Electrical strength 

＞1.3KV/mm 

16 

Withstand current 

10A 

17 

Peel strength 

1.4N/mm 

18 

Solder Mark abrasion 

＞3H 

19 

Thermal shock 

288℃10 Second 

20 

Self extinction 

94V-0 

21 

On off test voltage 

50-300V 

22

Color of solder mask ink

Red, yellow, blue, white, green, black

23

Surface treatment

HAL，OSP，ENIG，IG，GOLD FINGER 

24

Gilding thickness

gold imersion:1-3mil;

gold plating:0.1-0.3mil